Polished Cross Sections

Many manufactured materials, as simple as laminated wood surfaces or as intricate as an integrated circuit package, will require custom preparation in order to analyze a sample.  Cross sectioning allows for the preparation of a sample in order to expose specific features for analysis.  MicroVision Labs can prepare a wide variety of materials with precision cross sectioning and polishing services in order to allow these features to be presented. Materials can be mounted and embedded in a variety of epoxies and polymer compounds in order to stabilize and enforce materials.  Materials can then be sectioned with a diamond saw or microtome, and polished in order to smooth any cutting artifacts.  Precise depths of sectioning can be maintained, in order to highlight specific areas of interest.

Advantages:

  • Specific areas in electronic package devices can be sectioned and examined

  • Thicknesses and homogeneity of layers can be illustrated quickly

  • Alloys and interior grain structure in metallic samples can be documented with etches and preferential dyes

  • Multi-layer printing and coating samples can be examined to check for bonding and lamination continuity

  • Polymers can be sectioned and polished in order to determine interior consistency in formation

  • Packaged devices are sectioned at key points to document mechanical or wire bonds and perform detailed failure analysis

Application Fields:

  • Manufacturing Technologies

  • Electronic Packages

  • Semi-Conductor Design

  • Construction and Coating Technologies

  • Printing and Paper Processing

  • Metallography

  • Mineralogy and Geology

  • Composite Environmental Analysis

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Copyright 2018 MicroVision Labs, Inc.

187 Billerica Road | Chelmsford, MA 01824
Phone: 978-250-9909 | Fax: 978-250-9901 | Toll Free: 877-250-9909

We look forward to working with you and would be pleased to answer any questions.